Testing & Screening

100% physical & electrical screening of finished product is performed to guarantee that products comply with specification.

Quality Control

At RFT, quality is more than just a departmental function. We believe that quality is every employees responsibility. Every employee is expected to perform his/her work function to the highest possible standards. RFT is dedicated to manufacture the most reliable products available in the market. We work very hard to ensure that highest quality products are shipped everyday.

Availability

RFT stocks most of the package styles with standard values. Lead-time for non-stock item is 6-8 weeks ARO.

Custom Design

RFT’s technical staff has extensive experience in the design of high power RF/microwave amplifiers, combiners and other components used for cellular and military applications. This gives RFT a unique capability to meet customer's design requirement. Customer Service RFT is constantly improving customer service and quality of products to better meet customer demands. Mounting Techniques. All devices should be properly mounted in order to reduce mechanical and thermal stresses, which can degrade the MTBF of the devices. The devices must be mounted on a flat surface (. 002") in order to achieve the maximum heat transfer. (The following is a guideline outlining the proper techniques for mounting RF Techniques power component.

Flanged Parts

Flange Packages should be mounted on a flat surface (. 002") in order to achieve the maximum heat transfer. Also, avoid twisting or bending the flanges before installation. High quality silicone grease should be used sparingly on the flange of the device. The idea is to fill in the micro irregularities on the surfaces rather than creating a continuous layer of silicone grease. The best way to apply the grease is with a flat razor blade. The mounting bolts should be torqued to insure a solid contact with heat sink. Over torquing can cause the flange to bow in the middle. The devices should be mounted such that they have sufficient stress relief with the circuit board. The package should be as close as possible to the circuit board to reduce parasitic inductance caused by excessive lead length. For more information, contact one of our engineers.

Flangeless Parts

There are two basic ways of mounting un-flanged devices. One way is to solder the devices to a heat sink using tin/lead solder. This method assures a continuous ground plane and produces good thermal contact between the devices and the heat sink. This technique requires tin/lead plated heatsink (or other metal that will wet with the gold or nickel plating of the device to produce a good solder connection). The alternate method is to clamp the device to the heatsink with some type of clamping mechanism. It is recommended that Indium foil be used rather than heatsink compound to ensure a good thermal and electrical contact. This method requires a good clamping mechanism that will work correctly. Either of the methods described above will work for most applications. The solder technique is used by majority of customers. RFT brazed devices will be able to withstand low or high temperature soldering